Jump to content

Category:Wire bonding

From Wikimedia Commons, the free media repository

Wire bonding

technique used to connect a microchip to its package

wire bonding in a small silicon transistor

Upload media

Instance of

production process
welding
soldering or brazing

Subclass of

production process

Part of

semiconductor device fabrication

Has use

semiconductor device

Has part(s)

ball bonding
wedge bonding

Authority file
Q750783 Library of Congress authority ID: sh97004222 J9U entity ID: 987007566164005171
Reasonator Scholia Wikidocumentaries PetScan statistics WikiMap Locator tool KML file Search depicted

Media in category "Wire bonding"

The following 200 files are in this category, out of 391 total.

(previous page) (next page)

01CII 108Q.jpg 4,204 × 3,868; 9.07 MB
07R01 (cropped ball-wedge bonding).jpg 2,074 × 1,367; 1.52 MB
07R01.jpg 6,500 × 4,200; 14.15 MB
1ir141b 2.jpg 3,083 × 2,055; 1.67 MB
1ir141b 4.jpg 2,654 × 1,769; 1.18 MB
1lb142b 1.jpg 3,455 × 2,303; 2.16 MB
1lb142b 2.jpg 3,050 × 2,033; 1.51 MB
201lb1 1.jpg 2,460 × 1,640; 1.21 MB
201lb1 2.jpg 1,335 × 890; 335 KB
202ls4 2.jpg 2,965 × 1,977; 1.51 MB
217ЛБ2Б кристалл.jpg 801 × 850; 127 KB
240ИЛ1Б Полярон.jpg 1,349 × 1,790; 1.76 MB
240ЛА1В Полярон.jpg 1,345 × 1,807; 1.86 MB
240ЛА2 топология.jpg 696 × 464; 215 KB
248АП2 сварка выводов (1).jpg 2,303 × 3,455; 1.51 MB
248АП2 сварка выводов (2).jpg 2,027 × 3,041; 1.23 MB
248АП2 сварка выводов (3).jpg 2,272 × 3,408; 1.48 MB
248АП2 транзистор (6).jpg 1,406 × 1,055; 395 KB
248АП2 транзисторная двойка (1).jpg 3,282 × 2,216; 1.83 MB
265УВ6 НЭВЗ (5).jpg 2,721 × 1,814; 1.44 MB
265УВ6 НЭВЗ (6).jpg 3,203 × 2,135; 1.6 MB
2ie311 2.jpg 3,408 × 2,272; 1.52 MB
2N2222.jpg 4,000 × 3,796; 6.18 MB
2N3055 - close up pic of wires bonding to the silicon package.jpg 4,338 × 2,826; 10.49 MB
2N3771 die 1.jpg 1,900 × 1,500; 1.07 MB
2N3771 die.jpg 2,048 × 1,365; 857 KB
2N3773 die.jpg 5,000 × 4,200; 12.21 MB
2N4957 die.jpg 925 × 826; 411 KB
2N4957 wire bonding.jpg 2,580 × 2,400; 3.55 MB
2N5038 die.jpg 5,000 × 4,200; 13.88 MB
2N5872B die.jpg 5,000 × 4,200; 10.6 MB
2N5881 die.jpg 5,000 × 4,200; 13.66 MB
2N5886 die 1.jpg 1,700 × 1,450; 542 KB
2N5886 die.jpg 2,000 × 1,680; 1,005 KB
2N6282 die.jpg 5,500 × 4,400; 9.93 MB
2N6285 die.jpg 5,500 × 4,400; 11.03 MB
2N930 wire bonding.jpg 1,000 × 1,000; 465 KB
2N930.jpg 4,300 × 3,800; 7.41 MB
2N990 wire bonding.jpg 2,570 × 2,100; 2.51 MB
2nt012 1.jpg 1,161 × 1,214; 357 KB
2SC867 internal view.jpg 3,960 × 2,860; 8.05 MB
2SC867 silicon die.jpg 2,816 × 2,604; 5.71 MB
2T812A die.jpg 3,420 × 2,949; 5.94 MB
2TC843A (05).jpg 3,186 × 2,124; 1.93 MB
2TC843A (06).jpg 2,252 × 1,501; 1.01 MB
2TC843A (07).jpg 2,751 × 1,834; 1.29 MB
2TC843A (09).jpg 3,408 × 2,272; 1.58 MB
2TC843A (11).jpg 2,268 × 1,512; 755 KB
2ue181 4.jpg 1,250 × 853; 284 KB
2ui472 4.jpg 3,330 × 2,220; 2.14 MB
2us723g 1.jpg 3,455 × 2,303; 2.56 MB
2Т670АС четыре транзистора (02).jpg 3,408 × 2,272; 2.41 MB
2Т670АС четыре транзистора (03).jpg 2,919 × 1,946; 1.27 MB
2Т670АС четыре транзистора (04).jpg 2,832 × 1,888; 1.16 MB
2Т670АС четыре транзистора (05).jpg 2,468 × 1,645; 1,019 KB
2Т670АС четыре транзистора (06).jpg 2,859 × 1,906; 1.12 MB
2Т670АС четыре транзистора (07).jpg 2,241 × 1,494; 839 KB
2Т670АС четыре транзистора (08).jpg 1,280 × 1,024; 340 KB
2ТК171А топология.jpg 347 × 343; 81 KB
2УП402 топология.jpg 696 × 464; 217 KB
2УС656 НЭВЗ (4).jpg 3,281 × 2,215; 2.16 MB
2УТ402 топология.jpg 699 × 466; 273 KB
304id6av 5.jpg 3,104 × 2,069; 1.56 MB
304id6av 6.jpg 3,154 × 2,103; 1.68 MB
304id6av 7.jpg 1,937 × 1,291; 876 KB
3EA4 Junction Field Effect Transistor.jpg 3,700 × 3,700; 9.81 MB
3mm LED Orange Clear.png 3,600 × 2,700; 6.72 MB
413ХЛ1 (10).jpg 2,916 × 1,944; 1.36 MB
413ХЛ1 (11).jpg 696 × 464; 149 KB
413ХЛ1 (3).jpg 3,113 × 2,075; 1.28 MB
413ХЛ1 (4).jpg 701 × 467; 151 KB
413ХЛ1 (5).jpg 1,715 × 1,143; 428 KB
413ХЛ1 (6).jpg 701 × 467; 118 KB
413ХЛ1 (7).jpg 2,821 × 1,881; 1.07 MB
413ХЛ1 (8).jpg 696 × 464; 113 KB
413ХЛ1 (9).jpg 1,083 × 722; 198 KB
447ui1 5.jpg 1,619 × 1,159; 444 KB
447um1 2small.jpg 391 × 260; 91 KB
447up5 3.jpg 1,600 × 1,200; 372 KB
448kp1 2.jpg 4,147 × 4,067; 3.57 MB
448sa1 11.jpg 894 × 596; 206 KB
448sa1 12.jpg 3,211 × 2,141; 1.84 MB
448sa1 12small.jpg 644 × 483; 117 KB
448sa1 13.jpg 2,743 × 1,829; 851 KB
448sa1 14.jpg 1,805 × 1,203; 609 KB
448sa1 15.jpg 2,649 × 1,766; 931 KB
448sa1 4.jpg 2,213 × 1,475; 1.11 MB
448sa1 6.jpg 1,863 × 1,242; 675 KB
448sa1 7.jpg 1,154 × 769; 270 KB
448sa1 8.jpg 1,425 × 950; 346 KB
5-211 Siliconix Inc.jpg 6,236 × 4,194; 13.11 MB
5050 SMD RGB LED.png 6,244 × 4,210; 26.93 MB
555-type Oscilator Integrated Circuit.jpg 640 × 480; 34 KB
826kn1 3small.jpg 700 × 466; 231 KB
826sp1 3.jpg 2,601 × 2,313; 678 KB
826ur1 5.jpg 1,600 × 1,067; 420 KB
8УИ013 КНИИРЭ (91).jpg 3,408 × 2,272; 1.7 MB
8УИ013 КНИИРЭ (92).jpg 697 × 464; 120 KB
8УИ013 КНИИРЭ (93).jpg 686 × 458; 148 KB
8УИ013 КНИИРЭ (94).jpg 700 × 467; 126 KB
AD570 571.png 3,930 × 2,460; 13.95 MB
AD580.jpg 4,394 × 4,245; 6.98 MB
AF 106 die.jpg 1,911 × 1,581; 1.28 MB
AMD3101E (cropped wedge-wedge bonding).jpg 1,030 × 837; 1.16 MB
AMD3101E.jpg 4,362 × 2,910; 15.02 MB
Amdahl 481K die 02.jpg 6,160 × 4,372; 7.26 MB
Amdahl 481K die 03.jpg 5,440 × 4,532; 9.69 MB
Amdahl 481K die.jpg 3,560 × 3,462; 5.5 MB
Amdahl 5860 Computer Air Cooled Logic processor die.jpg 2,700 × 2,700; 4.67 MB
AT28HC256 die.jpg 5,801 × 4,000; 18.25 MB
Avago ADNS-5030 optical mouse sensor disassembled.jpg 1,494 × 1,500; 428 KB
Axial diode assembly.png 745 × 818; 54 KB
Ball-wedge sequence.svg 660 × 240; 32 KB
BALL-WEDGE.jpg 1,817 × 566; 117 KB
BC160.jpg 6,602 × 4,370; 22.81 MB
BC179 wire bonding.jpg 2,400 × 2,250; 3.31 MB
BC441.jpg 2,550 × 2,550; 3.8 MB
BDX18 die.jpg 5,600 × 4,400; 11.44 MB
BF167 die.jpg 2,440 × 2,485; 4.56 MB
BF257 wire bonding.jpg 2,260 × 2,520; 3.08 MB
BFW16A silicon die.jpg 1,900 × 1,640; 1.56 MB
BFW17A wire bonding.jpg 960 × 680; 559 KB
BFY90 wire bonding.jpg 2,140 × 1,900; 2.1 MB
BGA - Querschnitt.svg 728 × 390; 3 KB
BGA package sideview.PNG 740 × 470; 43 KB
BGA Package Sideview.svg 728 × 390; 16 KB
BGA16 and SOT23-6.jpg 760 × 400; 108 KB
BLF2045.jpg 3,300 × 1,800; 2.93 MB
BLF861A die photo.jpg 4,180 × 1,790; 3.44 MB
Bonden 1-4.png 768 × 188; 6 KB
Bondkontakt Gold-Aluminium.svg 500 × 300; 13 KB
BSX12S wire bonding.jpg 2,900 × 2,170; 6.73 MB
BU108 die 1.jpg 2,048 × 2,048; 1,000 KB
BU108 die.jpg 1,980 × 1,475; 1.08 MB
BU133 die.jpg 4,700 × 4,000; 7.67 MB
BU208A die.jpg 13,200 × 4,450; 30.34 MB
BU209 die.jpg 6,956 × 4,638; 11.64 MB
BU415 die.jpg 6,950 × 4,640; 14.7 MB
Burr-Brown OPA103.jpg 6,148 × 4,138; 15.81 MB
BUX83 die 1.jpg 1,400 × 1,400; 697 KB
BUX83 die.jpg 5,180 × 4,470; 7.95 MB
C4702A.jpg 3,900 × 3,000; 9.02 MB
CA3140.jpg 1,626 × 1,822; 2.47 MB
Calendar-leapyeardate.jpg 3,600 × 2,400; 2 MB
Canon LE-10 one 7 segment LEDs details.jpg 2,800 × 2,640; 3.37 MB
CD-ROM Photodetector.jpg 1,356 × 1,017; 383 KB
Cdchip.jpg 1,000 × 697; 449 KB
Cer-DIP package sideview.PNG 900 × 640; 49 KB
Ceramic-DIP package sideview.PNG 800 × 580; 46 KB
ChipScaleClock2 HR.jpg 1,465 × 1,449; 1.29 MB
Close up pic of a CII 72 silicon die.jpg 1,627 × 1,394; 1.93 MB
Close up pic of an aluminium wires bonding to a silicon package-CII72.jpg 2,250 × 1,800; 3.02 MB
Close up pic of an aluminium wires wedge-bonded to a MD6100 transistor package.jpg 612 × 500; 414 KB
Close up pic of an aluminium wires wedge-bonded to a silicon die-MD6100 transistor.jpg 736 × 564; 505 KB
CRP INDUSTRIES 2N2222.jpg 3,900 × 3,320; 4.19 MB
Cryptoleq Processor.jpeg 2,560 × 1,440; 901 KB
CSP package sideview.PNG 1,080 × 700; 83 KB
CSP(lead-frame) package sideview.PNG 1,080 × 1,300; 116 KB
Decapped MSP430F1101A.jpg 3,072 × 2,304; 1.27 MB
DIP Cross-section.svg 250 × 200; 18 KB
DIP package sideview.PNG 1,000 × 600; 53 KB
DIS790 die.jpg 6,700 × 4,470; 4.86 MB
DIS790.jpg 6,210 × 3,555; 2.36 MB
Electroformed beam leaded integrated circuit.png 1,134 × 1,176; 2.69 MB
EPROM AM27C010.jpg 2,558 × 1,185; 470 KB
EPROM AM27C256 (1).png 1,900 × 844; 4.11 MB
EPROM Fenster (2).jpg 2,656 × 2,656; 3.95 MB
EPROM Fenster.jpg 4,032 × 3,024; 3.9 MB
EPROM Intel C1702A.jpg 1,275 × 665; 576 KB
EPROM M27C512.JPG 2,616 × 2,367; 3.97 MB
EPROM Microchip SuperMacro.jpg 4,290 × 2,856; 2.48 MB
Eprom-detail.jpg 352 × 352; 38 KB
Eprom-střední.jpg 800 × 622; 144 KB
Eprom60x.jpg 512 × 384; 29 KB
Epromchip.jpg 1,494 × 1,422; 640 KB
EPROMdie.jpg 1,600 × 1,273; 1.67 MB
Epromf.jpg 1,084 × 1,294; 133 KB
ER1400 02.jpg 1,280 × 1,280; 1.53 MB
ER1400 03.jpg 4,500 × 3,600; 12.44 MB
EXP416.jpg 6,400 × 4,300; 17.65 MB
Fairchild uA791KC.jpg 3,000 × 2,400; 8.07 MB
Flip chip.jpg 541 × 203; 19 KB
Fotothek df n-15 0000513 Elektronikbausteine.jpg 800 × 559; 236 KB
Fotothek df n-15 0000516 Elektronikbausteine.jpg 768 × 551; 183 KB
Fotothek df n-15 0000518 Elektronikbausteine.jpg 784 × 541; 168 KB
Fotothek df n-15 0000519 Elektronikbausteine.jpg 800 × 531; 126 KB
Gold wire for wire bonding.JPG 1,600 × 1,200; 1.25 MB
Gold-aluminium intermetallic.svg 500 × 300; 14 KB
HAN4271 die.jpg 4,580 × 4,070; 6.06 MB
HDLG-2416 7 x 5 Dot Matrix Green LED Display.jpg 3,000 × 2,100; 2.06 MB
HDSP2000.jpg 5,400 × 4,000; 5.18 MB
Hybrid IC substrate bond wires.jpg 4,254 × 3,074; 2.16 MB
ICM7107.jpg 3,000 × 2,400; 4.45 MB
ICM7107x.jpg 3,500 × 2,870; 7.02 MB
InGaN-based green LED top view.jpg 3,220 × 2,740; 1.45 MB
InGaN-based green LED.jpg 3,750 × 2,850; 5.07 MB
Integrated circuit optical sensor.jpg 2,304 × 1,728; 1.64 MB
Integrated circuit wire bonding.jpg 2,480 × 2,140; 2.06 MB
Intel 8742 153056995.jpg 1,740 × 1,344; 411 KB
IRF130 die.jpg 5,500 × 4,398; 16.39 MB

(previous page) (next page)

Retrieved from "https://commons.wikimedia.org/w/index.php?title=Category:Wire_bonding&oldid=987751819"

Non-topical/index:

Uses of Wikidata Infobox